A partition decoupling algorithm for compact thermal model in Multi-Chip IGBT modules

W. Guo; M. Ma; H. Wang; Q. Song; W. Chen

doi:10.1109/TPEL.2022.3201976

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A partition decoupling algorithm for compact thermal model in Multi-Chip IGBT modules

Journal article

Peer reviewed

A partition decoupling algorithm for compact thermal model in Multi-Chip IGBT modules

W. Guo, M. Ma, H. Wang, H. Wang, Q. Song and W. Chen

IEEE Transactions on Power Electronics, Vol.38(1), pp.66-72

2022

DOI: https://doi.org/10.1109/TPEL.2022.3201976

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Abstract

This letter proposes a partition decoupling algorithm for the compact thermal model to reduce the computation burden in the multi-chip IGBT modules. As a typical coupled system, the compact thermal model is split into separate thermal models with several shared interfaces. The interface data, coupling power loss, coming from the previous time step is used to calculate the real temperature in the current time step. The proposed algorithm transforms the spatial coupling of the compact thermal model into the temporal coupling. Furthermore, based on the proposed partition decoupling algorithm, some more loosely coupled algorithms are also designed. Finally, both simulation and experiment are conducted to verify three loosely coupled algorithms.

Details

Title: A partition decoupling algorithm for compact thermal model in Multi-Chip IGBT modules
Authors/Creators: W. Guo (Author/Creator) - Hefei University of Technology
M. Ma (Author/Creator) - Hefei University of Technology
H. Wang (Author/Creator) - Murdoch University
H. Wang (Author/Creator) - Murdoch University
Q. Song (Author/Creator) - Hefei University of Technology
W. Chen (Author/Creator) - Sungrow Power Supply Co., Ltd., Hefei, China
Publication Details: IEEE Transactions on Power Electronics, Vol.38(1), pp.66-72
Publisher: IEEE
Identifiers: 991005542745007891
Murdoch Affiliation: School of Engineering and Energy
Language: English
Resource Type: Journal article

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Collaboration types: Domestic collaboration; International collaboration
Citation topics: 5 Physics; 5.31 Silicon Systems; 5.31.533 SiC Power Devices
Web Of Science research areas: Engineering, Electrical & Electronic
ESI research areas: Engineering