A thermal estimation method for IGBT module adaptable to operating conditions

W. Guo; M. Ma; H. Wang; S. Yang; X. Zhang; X. Yan; W. Chen; G. Cai

doi:10.1109/TPEL.2020.3033790

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A thermal estimation method for IGBT module adaptable to operating conditions

Journal article

Peer reviewed

A thermal estimation method for IGBT module adaptable to operating conditions

W. Guo, M. Ma, H. Wang, S. Yang, X. Zhang, X. Yan, W. Chen and G. Cai

IEEE Transactions on Power Electronics, Vol.36(6), pp.6147-6152

2021

DOI: https://doi.org/10.1109/TPEL.2020.3033790

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Abstract

This letter proposes a novel junction temperature estimation method for the IGBT module to adapt to various operating conditions and improve the computing efficiency. By using the superposition theorem and odd/even mode analysis, the input power loss is decomposed into the even and odd mode loss. Further, the thermal model considering the thermal coupling between the upper and lower arms is equivalently decomposed into the even and odd mode thermal model according to the structure symmetry. The odd mode power loss is the cause of the thermal coupling between the upper and lower arms, and the odd mode junction temperature variation is used as an indicator to measure the thermal coupling. Based on the frequency domain analysis, the dividing line for operating condition with weak thermal coupling and strong thermal coupling can be obtained. Finally, experimental results verify the validity of the theoretical analysis and the accuracy of the proposed thermal estimation method.

Details

Title: A thermal estimation method for IGBT module adaptable to operating conditions
Authors/Creators: W. Guo (Author/Creator) - Hefei University of Technology
M. Ma (Author/Creator) - Hefei University of Technology
H. Wang (Author/Creator) - Murdoch University
S. Yang (Author/Creator) - Hefei University of Technology
X. Zhang (Author/Creator) - Hefei University of Technology
X. Yan (Author/Creator) - Hefei University of Technology
W. Chen (Author/Creator) - Sungrow Power Supply Co., Ltd., Hefei, China
G. Cai (Author/Creator) - Sungrow Power Supply Co., Ltd., Hefei, China
Publication Details: IEEE Transactions on Power Electronics, Vol.36(6), pp.6147-6152
Publisher: IEEE
Identifiers: 991005540345807891
Murdoch Affiliation: School of Engineering and Energy
Language: English
Resource Type: Journal article

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Collaboration types: Domestic collaboration; International collaboration
Citation topics: 5 Physics; 5.31 Silicon Systems; 5.31.533 SiC Power Devices
Web Of Science research areas: Engineering, Electrical & Electronic
ESI research areas: Engineering