Journal article
Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique
International Journal of Advanced Manufacturing Technology, Vol.27(7/8), pp.708-714
2006
Abstract
Deformations of a Si-epoxy-FR4 (simplified flip chip) structure under thermal testing were inspected with a real-time Moiré technique. Specimens without cracks and specimens with a crack at the silicon-epoxy interface were prepared. The measurement results showed that the maximum deformation appeared at the edge. When the specimen was cooled to 20 °C, there was residual plastic deformation in the specimen. The creep effect was more dominant in the FR4-epoxy interface. Upon cooling to 20 °C, the specimen experienced partial strain recovery. To characterize the behavior of the interfacial crack, stress intensity factors KI and K II, and the strain energy release rate G in the vicinity of the crack tip were calculated using the measured deformations to conduct a quantitative study. It was observed that a sharp strain gradient occurred at the crack tip. KI and KII were dependent on temperature, and G was dominated by KI for the interfacial crack in the specimen.
Details
- Title
- Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique
- Authors/Creators
- Z.W. Zhong (Author/Creator)K.W. Wong (Author/Creator)X.Q. Shi (Author/Creator)
- Publication Details
- International Journal of Advanced Manufacturing Technology, Vol.27(7/8), pp.708-714
- Publisher
- Springer Verlag
- Identifiers
- 991005539985107891
- Copyright
- © Springer-Verlag London Limited 2005
- Murdoch Affiliation
- School of Information Technology
- Language
- English
- Resource Type
- Journal article
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