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Exposure-resolved VLEED from the O-Cu(001: bonding dynamics
Journal article   Peer reviewed

Exposure-resolved VLEED from the O-Cu(001: bonding dynamics

C.Q. Sun
Vacuum, Vol.48(6), pp.535-541
1997
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Abstract

The appraisal of an association of the VLEED technique and the new models for oxygen chemisorption [Vacuum, J. Phys. Chem. Solids, in press] motivated and enabled us to seek physical insight into the dynamics of the O-Cu(001) surface reaction. It is shown that the discrete stages revealed by exposure-resolved VLEED can be quantified and interpreted by the process dominated by three bonding parameters: First, one Goldschmidt-contraction ionic bond forms between the O adsorbate and a Cu atom on the surface accompanying the vacating of the missing row. Second, another contracting ionic bond follows between the O and a Cu in the substrate; as a result, the oxygen buckles into the bulk. Then, the ionic bond angle increases leading to the relaxation, and finally, interaction develops between the non-bonding states of the oxygen and the lone-pair-induced metal dipoles.

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Citation topics
2 Chemistry
2.41 Catalysts
2.41.25 Catalytic Oxidation
Web Of Science research areas
Materials Science, Multidisciplinary
Physics, Applied
ESI research areas
Materials Science
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