Journal article
Exposure-resolved VLEED from the O-Cu(001: bonding dynamics
Vacuum, Vol.48(6), pp.535-541
1997
Abstract
The appraisal of an association of the VLEED technique and the new models for oxygen chemisorption [Vacuum, J. Phys. Chem. Solids, in press] motivated and enabled us to seek physical insight into the dynamics of the O-Cu(001) surface reaction. It is shown that the discrete stages revealed by exposure-resolved VLEED can be quantified and interpreted by the process dominated by three bonding parameters: First, one Goldschmidt-contraction ionic bond forms between the O adsorbate and a Cu atom on the surface accompanying the vacating of the missing row. Second, another contracting ionic bond follows between the O and a Cu in the substrate; as a result, the oxygen buckles into the bulk. Then, the ionic bond angle increases leading to the relaxation, and finally, interaction develops between the non-bonding states of the oxygen and the lone-pair-induced metal dipoles.
Details
- Title
- Exposure-resolved VLEED from the O-Cu(001: bonding dynamics
- Authors/Creators
- C.Q. Sun (Author/Creator) - Murdoch University
- Publication Details
- Vacuum, Vol.48(6), pp.535-541
- Publisher
- Elsevier
- Identifiers
- 991005544975107891
- Copyright
- © 1997 Elsevier Science Ltd
- Murdoch Affiliation
- School of Mathematical and Physical Sciences
- Language
- English
- Resource Type
- Journal article
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- Citation topics
- 2 Chemistry
- 2.41 Catalysts
- 2.41.25 Catalytic Oxidation
- Web Of Science research areas
- Materials Science, Multidisciplinary
- Physics, Applied
- ESI research areas
- Materials Science