Interfacial behavior of a flip-chip structure under thermal testing

Z.W. Zhong; K.W. Wong; X.Q. Shi

doi:10.1109/TEPM.2004.830516

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Interfacial behavior of a flip-chip structure under thermal testing

Journal article

Open access

Peer reviewed

Interfacial behavior of a flip-chip structure under thermal testing

Z.W. Zhong, K.W. Wong and X.Q. Shi

IEEE Transactions on Electronics Packaging Manufacturing, Vol.27(1), pp.43-48

2004

DOI: https://doi.org/10.1109/TEPM.2004.830516

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Abstract

In this paper, the interfacial behavior of a flip-chip structure under thermal testing was investigated using high sensitivity, real-time Moire interferometry. The model package studied was a sandwich structure consisting of a silicon chip, epoxy underfill and FR4 substrate. The behavior of FR4-underfill and silicon-underfill interfaces of the specimen under certain thermal loading was examined. The results show that the shear strain variation increases significantly along the interfaces, with the maximum shear strain concentration occurring at the edge of the specimen. At the edge, the maximum shear strain occurs at the silicon-underfill interface, and the FR4-underfill interface experiences a slightly lower shear strain. The creep effect is more dominant in the FR4-underfill interface when the specimen is heated for 2 h at 100°C. Upon cooling to 20°C, both the interfaces of the specimen experience partial strain recovery.

Details

Title: Interfacial behavior of a flip-chip structure under thermal testing
Authors/Creators: Z.W. Zhong (Author/Creator) - Nanyang Technological University
K.W. Wong (Author/Creator) - Nanyang Technological University
X.Q. Shi (Author/Creator)
Publication Details: IEEE Transactions on Electronics Packaging Manufacturing, Vol.27(1), pp.43-48
Publisher: IEEE
Identifiers: 991005544677207891
Murdoch Affiliation: Murdoch University
Language: English
Resource Type: Journal article

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Collaboration types: Domestic collaboration
Citation topics: 7 Engineering & Materials Science; 7.272 Electrical - Solder & Connections; 7.272.538 Solder Joints
Web Of Science research areas: Engineering, Manufacturing
ESI research areas: Engineering