Real-time average junction temperature estimation for multichip IGBT modules with low computational cost

W. Guo; M. Ma; H. Wang; N. Xiang; Z. Chen; W. Chen

doi:10.1109/TIE.2022.3176284

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Real-time average junction temperature estimation for multichip IGBT modules with low computational cost

Journal article

Peer reviewed

Real-time average junction temperature estimation for multichip IGBT modules with low computational cost

W. Guo, M. Ma, H. Wang, N. Xiang, H. Wang, Z. Chen and W. Chen

IEEE Transactions on Industrial Electronics, Vol.70(4), pp.4175-4185

2022

DOI: https://doi.org/10.1109/TIE.2022.3176284

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Abstract

Average thermal model

finite element method (FEM)

insulated gate bipolar transistors (IGBT)

junction temperature estimation

thermal model extraction

The junction temperature of the insulated gate bipolar transistor (IGBT) modules is a vital parameter for the reliability of the power electronic system. For effective thermal management, it is necessary to estimate junction temperature in real time. However, existing thermal models have limitations to achieve fast temperature prediction for multichip IGBT modules. In this study, we investigate the real-time junction temperature prediction for multichip IGBT modules with low computational cost. According to the power module' structure, an average 2D thermal model with physical significance is proposed to predict the virtual junction temperature for multichip IGBT modules, which can be extracted from finite element model based on the least square method. To further improve the computational efficiency, a temperature predictor based on the staggered cycle-by-cycle calculation method is proposed and its prediction error under various extreme operation conditions is analyzed by enumeration method. Finally, the comprehensive experimental results verify the effectiveness of the proposed average thermal model and junction temperature prediction method.

Details

Title: Real-time average junction temperature estimation for multichip IGBT modules with low computational cost
Authors/Creators: W. Guo (Author/Creator) - Hefei University of Technology
M. Ma (Author/Creator) - Hefei University of Technology
H. Wang (Author/Creator) - Murdoch University
N. Xiang (Author/Creator) - Hefei University of Technology
H. Wang (Author/Creator) - Murdoch University
Z. Chen (Author/Creator) - Hefei University of Technology
W. Chen (Author/Creator) - Sungrow Power Supply Co Ltd, 474731 Hefei, Anhui, China
Publication Details: IEEE Transactions on Industrial Electronics, Vol.70(4), pp.4175-4185
Publisher: IEEE
Identifiers: 991005542111907891
Murdoch Affiliation: College of Science, Health, Engineering and Education
Language: English
Resource Type: Journal article

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Collaboration types: Domestic collaboration; International collaboration
Citation topics: 5 Physics; 5.31 Silicon Systems; 5.31.533 SiC Power Devices
Web Of Science research areas: Automation & Control Systems; Engineering, Electrical & Electronic; Instruments & Instrumentation
ESI research areas: Engineering